Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement
Author:
Affiliation:
1. A*STAR (Agency for Science, Technology and Research),Institute of Microelectronics,Innovis,Singapore,138634
2. Rain Tree Photonics Pte Ltd,D’Lithium,Singapore,368001
Funder
Science and Engineering Research Council
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457916.pdf?arnumber=10457916
Reference11 articles.
1. Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics
2. Integrated Optical Interconnect Systems (iOIS) for Silicon Photonics Applications in HPC
3. High Density Integration Technologies for SiPh Based Optical I/Os
4. A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres
5. A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications
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