Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism
Author:
Affiliation:
1. Western Digital,Milpitas,CA,USA,95035-7933
2. IMEC,Leuven,Belgium
3. Western Digital,Leuven,Belgium
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9764406/9764408/09764478.pdf?arnumber=9764478
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