Author:
Lhostis S.,Ayoub B.,Frémont H.,Moreau S.,Mattei J.-G.,Lamontagne P.,Tournier A.
Funder
Agence Nationale de la Recherche
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Evolution of image sensor architectures with stacked device technologies;Oike;IEEE Trans. Electr. Dev.,2022
2. Impacts of misalignment on 1 μm pitch Cu-Cu hybrid bonding;Kagawa,2020
3. Excellent reliability of xtackingTM bonding interface;Ouyang,2021
4. 700 nm pitch Cu/SiCN wafer-to-wafer hybrid bonding;Chew,2022
5. A true process-heterogeneous stacked embedded DRAM structure based on wafer-level hybrid bonding;Wang;Electronics,2023
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献