Packaging Technology for Electronic Applications in Harsh High-Temperature Environments-Reference-Cited by-同舟云学术

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Packaging Technology for Electronic Applications in Harsh High-Temperature Environments

Published:2011-07 Issue:7 Volume:58 Page:2673-2682
ISSN:0278-0046
Container-title:IEEE Transactions on Industrial Electronics
language:
Short-container-title:IEEE Trans. Ind. Electron.

Author:

Hagler Ping,Henson Phillip,Johnson R. Wayne

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Control and Systems Engineering

Link

http://xplorestaging.ieee.org/ielx5/41/5873561/05447677.pdf?arnumber=5447677

Cited by 59 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Research on ceramic package for high temperature electronic devices;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

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