High-temperature microsystem packaging technology and high-temperature reliability
Author:
Publisher
Science China Press., Co. Ltd.
Subject
Engineering (miscellaneous),General Computer Science
Link
https://engine.scichina.com/doi/pdf/7259143AFFF245B29043EE8E6C7FD842
Reference13 articles.
1. Leuchter J, Stekly V, Blasch E. Investigation of avionics power switch loading versus aircraft electromagnetic compatibility. IEEE Aerosp Electron Syst Mag, 2015, 30: 24-34.
2. Puqi Ning null, Lei T G, Fei Wang T G. A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module. IEEE Trans Power Electron, 2010, 25: 2059-2067.
3. Leuchter J, Bloudicek R, Boril J. Influence of Aircraft Power Electronics Processing on Backup VHF Radio Systems. Electronics, 2021, 10:
4. Johnson R W, Evans J L, Jacobsen P. The Changing Automotive Environment: High-Temperature Electronics. IEEE Trans Electron Packag Manufact, 2004, 27: 164-176.
5. Chen M X. Advances in low thermal resistance packaging for high-power LEDs. Semicond Optoelectron, 2011, 32: 599--605.
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