Damage Evolution in SAC Solder Alloys-Reference-Cited by-同舟云学术

Damage Evolution in SAC Solder Alloys

Published:2022-04-25 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Chen Yaxiong¹,Hauck Torsten²,Fahim Abdullah¹,Haq Mohammad Ashraful³,Aminul Hoque Mohd³,Suhling Jeffrey C.³

Affiliation:

1. NXP Semiconductors,Austin,TX,USA

2. NXP Semiconductors,Munich,Germany

3. Auburn University,CAVE3,Auburn,AL,USA

Publisher

IEEE

Link

Reference10 articles.

1. Continuum damage mechanics: a continuum mechanics approach to the analysis of damage and fracture;murakami,2012

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Solder Fatigue Analyses and Predictions for PCB Mounted Components after Thirteen Years of Thermal Field Cycling;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

3. Analytical and experimental studies on the damage evolution of SAC solder alloys;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17