Mechanical Behavior and Microstructure Evolution in Lead Free Solders Subjected to Mechanical Cycling at Elevated Temperatures-Reference-Cited by-同舟云学术

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Mechanical Behavior and Microstructure Evolution in Lead Free Solders Subjected to Mechanical Cycling at Elevated Temperatures

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Hoque Mohd Aminul,Haq Mohammad Ashraful,Suhling Jeffrey C.,Lall Pradeep

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501918.pdf?arnumber=9501918

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints;Microelectronics Reliability;2024-09

2. Unravelling the synergistic enhancement effect of Ag3Sn phase and graphene nanosheets addition on the thermal cycling reliability of Sn–xAg–0.7Cu solder joint;Journal of Materials Science: Materials in Electronics;2024-05

3. Evolution of the Creep Response of SAC305 Solder Due to Mechanical Cycling;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

4. A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Contribution to the Calorimetric Study of the Bi-Ni-Sn Ternary System: Experimental and Theoretical Data;Biointerface Research in Applied Chemistry;2022-07-10

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