Thermal-stress analysis of SOIC packages and interconnections-Reference-Cited by-同舟云学术

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Thermal-stress analysis of SOIC packages and interconnections

Published:1988-12 Issue:4 Volume:11 Page:380-389
ISSN:0148-6411
Container-title:IEEE Transactions on Components, Hybrids, and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Comp., Hybrids, Manufact. Technol.

Author:

Lau J.H.,Harkins C.G.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx1/33/603/00016671.pdf?arnumber=16671

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Parametric Study of Thermal Stress and Analysis of Creep Strain Under Thermal Cyclic Loading in a Hybrid Quad Flat Package;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-03

2. Types;Electronic Enclosures, Housings and Packages;2019

3. Damage Initiation and Propagation in Voided Joints: Modeling and Experiment;Journal of Electronic Packaging;2008-02-04

4. Effect of cracks on thermal stress and strain of a tape automated bonded package;Composite Structures;1997-05

5. Nonlinear Analysis of a Ceramic Pin Grid Array (PGA) Soldered to an Orthotropic Epoxy Substrate;Thermal Stress and Strain in Microelectronics Packaging;1993

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