Author:
Zhou D.,Haseeb A. S. M. A.,Andriyana A.,Wong Yew Hoong,Sabri M. F. M.,Low B. Y.,Pang X. S.,Eu P. L.,Tan L. C.
Funder
Malaysia Collaborative Research in Engineering, Science and Technology (P12: Hybrid-High Density Lead-Frame Package) and
University of Malaya Partnership
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献