Author:
Wu C.M.L.,Lai J.K.L.,Wu Yongli
Subject
Civil and Structural Engineering,Ceramics and Composites
Reference9 articles.
1. Overview of TAB technology;Lau,1989
2. Thermal stress analysis of a multichip package design;Darveraux;IEEE Trans Components, Hybrids, Manuf. Technol.,1989
3. Thermal stress analysis of TAB packages and interconnections;Lau;IEEE Trans Components, Hybrids, Manuf. Technol.,1990
4. Analysis and simulation of thermal transients and resultant stresses and strains in TAB packaging;Jog;Trans ASME J. Electronic Packaging,1993
5. Thermal-stress analysis of SOIC packages and interconnections;Lau;IEEE Trans. Components, Hybrids, Manuf. Technol.,1988
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