Solving Technical and Economical Barriers to the Adoption of Through-Si-Via 3D Integration Technologies
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx5/4753888/4763398/04763408.pdf?arnumber=4763408
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of test structure on electromigration characteristics in three-dimensional through silicon via stacked devices;Japanese Journal of Applied Physics;2015-04-17
2. On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing;Microelectronic Engineering;2013-06
3. Electrical characterization of integrated passive devices using thin film technology for 3D integration;Journal of Zhejiang University SCIENCE C;2013-04
4. Conclusions and Future Directions;SpringerBriefs in Electrical and Computer Engineering;2012-08-27
5. TSVs for Power Delivery;SpringerBriefs in Electrical and Computer Engineering;2012-08-27
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