1. Ansoft - Q3D Extractor.
http://www.ansoft.com/products/si/q3d_extractor/
,
http://www.ansoft.com/products/si/q3d_extractor/
2. MITLL Low-Power FDSOI CMOS Process.
http://www.ece.umd.edu/~dilli/research/layout/MITLL_3D_2006/3D_PDK2.3/doc/ApplicationNotes2006-1.pdf
,
http://www.ece.umd.edu/~dilli/research/layout/MITLL_3D_2006/3D_PDK2.3/doc/ApplicationNotes2006-1.pdf
3. Predictive technology model (PTM).
http://www.eas.asu.edu/˜ptm/
4. Redistributed Chip Packaging (RCP) Technology.
http://www.freescale.com/webapp/sps/site/overview.jsp?code=ASIC_LV3_PACKAGING_RCP
.
http://www.freescale.com/webapp/sps/site/overview.jsp?code=ASIC_LV3_PACKAGING_RCP
5. (2009) International Technology Roadmap for Semiconductors.
http://wwwitrsnet/Links/2009ITRS/Home2009htm
http://www.itrs.net/