Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration-Reference-Cited by-同舟云学术

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Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration

Published:2019-12 Issue:6 Volume:36 Page:63-71
ISSN:2168-2356
Container-title:IEEE Design & Test
language:
Short-container-title:IEEE Des. Test

Author:

Cheng Shu-Feng^ORCID,Huang Po-Tsang,Wang Li-Chun^ORCID,Chang Mau-Chung Frank^ORCID

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/6221038/8890011/08786260.pdf?arnumber=8786260

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research of Vertical via Based on Silicon, Ceramic and Glass;Micromachines;2023-07-08

2. Novel BIST Solution to Test the TSV Interconnects in 3D Stacked IC’s;Electronics;2023-02-10

3. TSV BIST Repair: Design-For-Test Challenges and Emerging Solution for 3D Stacked IC's;2022 IEEE International Test Conference India (ITC India);2022-07-24

4. Advanced TSV-BIST Repair Technique to Target the Yield and Test Challenges in 3-D Stacked IC’S;Communications in Computer and Information Science;2022

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