Advanced TSV-BIST Repair Technique to Target the Yield and Test Challenges in 3-D Stacked IC’S
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Springer Nature Switzerland
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https://link.springer.com/content/pdf/10.1007/978-3-031-23973-1_3
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1. Novel BIST Solution to Test the TSV Interconnects in 3D Stacked IC’s;Electronics;2023-02-10
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