The hype, myths, and realities of testing 3D integrated circuits
Author:
Affiliation:
1. NVIDIA Corp.
2. Intel Corp.
3. Duke University
Funder
Semiconductor Research Corporation
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/2966986.2980097
Reference36 articles.
1. Test Challenges for 3D Integrated Circuits
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4. Oscillation-Based Prebond TSV Test
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