Author:
Huang Li-Ren,Huang Shi-Yu,Sunter Stephen,Tsai Kun-Han,Cheng Wu-Tung
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
46 articles.
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1. Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs;IEEE Transactions on Circuits and Systems II: Express Briefs;2024-08
2. A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method;IEEE Transactions on Instrumentation and Measurement;2024
3. TSPC Trigger-Based Testing Scheme for Pre-Bond Testing and Diagnosis of TSVs;2023 2nd International Conference on Sensing, Measurement, Communication and Internet of Things Technologies (SMC-IoT);2023-12-29
4. A DfT Technique for Electrical Interconnect Testing of Circuit Boards with 3D Stacked SRAM ICs;2023 IEEE CPMT Symposium Japan (ICSJ);2023-11-15
5. A Self-Biased Current Reference Source-Based Pre-Bond TSV Test Solution;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023