Comprehensive Analysis of Hole-Trapping in SiN Films with a Wide Range of Time Constants Based on Dynamic C-V
Author:
Affiliation:
1. Institute of Memory Technology R&D Kioxia Corporation,Yokohama,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10117589/10117581/10118083.pdf?arnumber=10118083
Reference7 articles.
1. Atomistic Study of Lateral Charge Diffusion Degradation During Program/Erase Cycling in 3-D NAND Flash Memory
2. Ultra-fast CV methods (< 10µs) for interface trap spectroscopy and BTI reliability characterization using MOS capacitors;frutuoso;Proc IEEE International Reliability Physics Symposium (IRPS),2022
3. Accurate Picture of Cycling Degradation in HfO2-FeFET Based on Charge Trapping Dynamics Revealed by Fast Charge Centroid Analysis
4. Further Investigation on Mechanism of Trap Level Modulation in Silicon Nitride Films by Fluorine Incorporation
5. A New Method to Extract the Charge Centroid in the Program Operation of Metal–Oxide–Nitride–Oxide–Semiconductor Memories
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1. Investigation of the Impact of Ferroelectricity Boosted Gate Stacks for 3D NAND on Short Time Data Retention and Endurance;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14
2. Impact of hydrogen plasma treatment on fluorine-contained silicon nitride films;Japanese Journal of Applied Physics;2024-04-01
3. Recovery of cycling-induced degradation of interfacial SiO2 in HfO2-FeFET and its impact on retention characteristics;Japanese Journal of Applied Physics;2024-01-08
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