Analysis of 1st & 3rd Quadrant Electrothermal Robustness of Symmetrical and Asymmetrical Double- Trench SiC Power MOSFETs Under UIS
Author:
Affiliation:
1. University of Bristol,School of Electrical Engineering,UK,BS8 1UB
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9935821/9936047/09936556.pdf?arnumber=9936556
Reference25 articles.
1. Impact of Temperature and Switching Rate on Properties of Crosstalk on Symmetrical & Asymmetrical Double-trench SiC Power MOSFET
2. Experimental and numerical demonstration and optimized methods for SiC trench MOSFET short-circuit capability
3. Gate Oxide Reliability Issues of SiC MOSFETs Under Short-Circuit Operation
4. The Trench Power MOSFET: Part I—History, Technology, and Prospects
5. Current Sharing of Parallel SiC MOSFETs under Short Circuit Conditions
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. High-Energy Dynamic Avalanche to Failure by Incremental Source-Voltage Increase in Symmetric Double-Trench & Asymmetric Trench SiC MOSFETs;IEEE Open Journal of Industry Applications;2024
2. Electrothermal Power Cycling to Failure of Discrete Planar, Symmetrical Double-Trench and Asymmetrical Trench SiC MOSFETs;IEEE Open Journal of Power Electronics;2023
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