Experimental and numerical demonstration and optimized methods for SiC trench MOSFET short-circuit capability
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7981281/7988866/07988993.pdf?arnumber=7988993
Cited by 32 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A novel SiC VD-MOSFET with optimized P-type shielding structure in JFET region for improved short circuit robustness;Engineering Research Express;2024-08-22
2. High-Energy Dynamic Avalanche to Failure by Incremental Source-Voltage Increase in Symmetric Double-Trench & Asymmetric Trench SiC MOSFETs;IEEE Open Journal of Industry Applications;2024
3. Review on the Reliability Mechanisms of SiC Power MOSFETs: A Comparison Between Planar-Gate and Trench-Gate Structures;IEEE Transactions on Power Electronics;2023-07
4. Investigations of Residual Damage in SiC Trench MOSFETs after Single and Multiple Short-Circuit Stress;2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD);2023-05-28
5. Investigation of a 4H-SiC Trench MOSFET with Back-Side Super Junction;Micromachines;2022-10-18
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