Modeling Approach for Design Selection and Reliability Analysis of SiC Power Modules-Reference-Cited by-同舟云学术

Modeling Approach for Design Selection and Reliability Analysis of SiC Power Modules

Published:2022-08-24 Issue: Volume: Page:
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Container-title:2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)
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Author:

Kovacevic-Badstuebner Ivana¹,Race Salvatore¹,Grossner Ulrike¹

Affiliation:

1. ETH Zurich,Advanced Power Semiconductor Laboratory,Zurich,Switzerland

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9894046/9894054/09894199.pdf?arnumber=9894199

Reference14 articles.

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2. Elastoplastic creep analysis of thermal stress and strain in aluminum interconnects of LSIs

3. Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law

4. Thermal anal-ysis of SiC power semiconductor packages using the structure function;race;Proc 7th Int Workshop Thermal Investigation ICs Systems (THERMINIC),2021

5. How long is your system going to last?;borucki;Bodo's Power Systems,2018

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3. Power Cycling of Sintered SiC Power MOSFET Baseplate-less Modules with Aluminum Oxide and Silicon Nitride Substrates;2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD);2023-05-28

4. Extended Analysis of Power Cycling Behavior of TO-Packaged SiC Power MOSFETs;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03