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Designing and Modeling for Power Integrity

  • Published:2010-05 Issue:2 Volume:52 Page:288-310
  • ISSN:0018-9375
  • Container-title:IEEE Transactions on Electromagnetic Compatibility
  • language:
  • Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Swaminathan Madhavan,Chung Daehyun,Grivet-Talocia Stefano,Bharath Krishna,Laddha Vishal,Xie Jianyong

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Cited by 62 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Analysis of Decoupling Capacitor Performance in Improving Power Integrity in Two Layer/Three Layer Printed Circuit Boards;European Journal of Electrical Engineering and Computer Science;2023-11-20

3. An SIE Formulation With Triangular Discretization and Loop Analysis for Parameter Extraction of Arbitrarily Shaped Interconnects;IEEE Transactions on Microwave Theory and Techniques;2023-10

4. Power Noise Suppression Using Power-and-Ground via Pairs for Signal and Power Integrity;2023 International Applied Computational Electromagnetics Society Symposium (ACES-China);2023-08-15

5. A Machine Learning-Based Method for Tuning the Control Loop of Fully Integrated Voltage Regulators;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-07
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