Power Noise Suppression Using Power-and-Ground via Pairs for Signal and Power Integrity
Author:
Affiliation:
1. Anhui University, School of Electronic Information Engineering,Hefei,China
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10249211/10249015/10249298.pdf?arnumber=10249298
Reference6 articles.
1. A Compact EBG Structure With Etching Spiral Slots for Ultrawideband Simultaneous Switching Noise Mitigation in Mixed Signal Systems
2. Practical EBG application to multilayer PCB: Impact on power integrity
3. Power Noise Suppression Using Power-and-Ground Via Pairs in Multilayered Printed Circuit Boards
4. Fractal Localized EBG Structure Intelligently Optimized by K-GRNN and GA Method for Signal and Power Integrity
5. On the Increment of the Bandwidth of Mushroom-Type EBG Structures With Glide Symmetry
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