An SIE Formulation With Triangular Discretization and Loop Analysis for Parameter Extraction of Arbitrarily Shaped Interconnects
Author:
Affiliation:
1. Research Institute for Frontier Science and the School of Electronic and Information Engineering, Beihang University, Beijing, China
2. College of Physics and Information Engineering, Fuzhou University, Fuzhou, China
Funder
National Natural Science Foundation of China
Defense Industrial Technology Development Program
Pre-Research Project
Fundamental Research Funds for the Central Universities
Fundamental Research Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
http://xplorestaging.ieee.org/ielx7/22/10273174/10089201.pdf?arnumber=10089201
Reference49 articles.
1. Entire Domain Basis Function Expansion of the Differential Surface Admittance for Efficient Broadband Characterization of Lossy Interconnects
2. Skin effect modeling based on a differential surface admittance operator
3. A Full-Wave Generalized PEEC Model for Periodic Metallic Structure With Arbitrary Shape
4. Electromagnetic Modeling of Lossy Interconnects From DC to High Frequencies With a Potential-Based Boundary Element Formulation
5. Direct Matrix Solution of Linear Complexity for Surface Integral-Equation-Based Impedance Extraction of Complicated 3-D Structures
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1. A Fast SIE Solver With Cut Set Analysis and Terminals as Supernodes for Interconnects;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-09
2. A hybrid one‐step leapfrog ADI‐FDTD and subgridding approach based on a heterogeneous computing platform;Microwave and Optical Technology Letters;2024-05
3. An Efficient and Accurate SIE Formulation with Loop Analysis for Arbitrary-Shaped Interconnects;2023 International Applied Computational Electromagnetics Society Symposium (ACES-China);2023-08-15
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