Geometry-Based Crosstalk Reduction in CNT Interconnects

Author:

Sathyakam P. Uma1,Mallick P. S.1ORCID,Singh Paridhi1

Affiliation:

1. School of Electrical Engineering, VIT University, Vellore 632014, Tamil Nadu, India

Abstract

This paper proposes novel triangular cross-sectioned geometry of carbon nanotube (CNT) bundles for crosstalk and delay reduction in CNT bundle interconnects for VLSI circuits. First, we formulate the equivalent single conductor (ESC) transmission line models of the interconnects. Through SPICE analysis of the ESC circuits, we find the propagation delays of the proposed CNT bundles. Next, we model the capacitively coupled interconnects for crosstalk analysis. It is found that the coupling capacitance of triangular CNT bundle is 29% lesser than the traditionally used square CNT bundles. Further, the crosstalk-induced delay of triangular interconnects is found to be 30% lesser when compared to square bundle interconnects. The reduction in delay is found to increase as the number of CNTs in the bundle increases. So, we suggest that triangular CNT bundles are the most suitable candidates as global interconnects.

Funder

VIT University

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Electrical and Electronic Engineering,Hardware and Architecture

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Modelling and Analysis of Copper and Carbon Nanotube VLSI Interconnects;Interconnect Technologies for Integrated Circuits and Flexible Electronics;2023-09-22

2. Perspective—Demystifying the Power Withstanding Capabilities of CNT Bundle Interconnects;ECS Journal of Solid State Science and Technology;2022-04-01

3. Crosstalk Analysis of Triangular CNT Bundle Interconnects;Journal of Electronic Materials;2021-09-28

4. Waveform analysis of carbon nanotube interconnects connected to various driver/load circuits;International Journal of Electronics;2021-01-20

5. Performance Analysis of Square and Triangular CNT Bundle Interconnects Driven by CNTFET-Based Inverters;Micro-Electronics and Telecommunication Engineering;2020

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