Characterization of ceramics based on laser speckle photometry

Author:

Chen LiliORCID,Cikalova Ulana,Bendjus Beatrice,Muench Stefan,Roellig Mike

Abstract

Abstract. Advanced ceramic components are frequently used in industrial applications. As a brittle material, ceramic reacts very suddenly to excessively high stresses. Existing defects lead to rapid crack growth followed by spontaneous destruction. This leads to a functional failure of the entire component. It is therefore important to develop innovative techniques to ensure a good quality condition of ceramic products. Laser speckle photometry (LSP) is an optical nondestructive testing method. It is based on the dynamic analysis of time-resolved speckle patterns that are generated by an external excitation. In this paper, we will present two investigations on ceramic components using the LSP technique. One is the nondestructive stress characterization on ceramic surfaces, and the other is the defect detection on ceramics components. The aim is to improve the quality and safety control of ceramic production in the challenging industrial field. Preliminary results have shown the potential of the LSP sensor system for the nondestructive characterization of ceramics in terms of stress monitoring and surface defect detection.

Publisher

Copernicus GmbH

Subject

Electrical and Electronic Engineering,Instrumentation

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Laser Speckle Photometry for Inline Defect Detection in Solder Connections of Power Electronics;tm - Technisches Messen;2024-08-01

2. Speckle pattern optimization in laser speckle photometry for non-destructive testing;Optics and Photonics for Advanced Dimensional Metrology III;2024-06-18

3. Introduction and accuracy improvement of laser speckle photometry for in-situ monitoring material densities in laser powder bed fusion of metals;Journal of Manufacturing Processes;2023-12

4. Inline solution for characterization of chip substrate connections by Laser Speckle Photometry;2023 IEEE 14th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED);2023-08-28

5. Defect Detection of Solder Connection Layer in Power Electronic Components by Laser Speckle Photometry;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

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