Material characterization by laser speckle photometry-Reference-Cited by-同舟云学术

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Material characterization by laser speckle photometry

Published:2012-09-11 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Bendjus Beatrice,Cikalova Ulana,Schreiber Juergen

Publisher

SPIE

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Laser Speckle Photometry for Inline Defect Detection in Solder Connections of Power Electronics;tm - Technisches Messen;2024-08-01

2. Noninvasive evaluation of the skin barrier in reconstructed human epidermis using speckle analysis: Correlation with Raman microspectroscopy;Skin Research and Technology;2024-04

3. Inline solution for characterization of chip substrate connections by Laser Speckle Photometry;2023 IEEE 14th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED);2023-08-28

4. Defect Detection of Solder Connection Layer in Power Electronic Components by Laser Speckle Photometry;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

5. Monitoring the apical growth characteristics of hairy roots using non‐invasive laser speckle contrast imaging;Engineering in Life Sciences;2021-12-13

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