Metrological applications of Mueller polarimetry in conical diffraction for overlay characterization in microelectronics-Reference-Cited by-同舟云学术

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Metrological applications of Mueller polarimetry in conical diffraction for overlay characterization in microelectronics

Published:2005-04-27 Issue:1 Volume:31 Page:63-69
ISSN:1286-0042
Container-title:The European Physical Journal Applied Physics
language:
Short-container-title:Eur. Phys. J. Appl. Phys.

Author:

Novikova T.,De Martino A.,Ossikovski R.,Drévillon B.

Publisher

EDP Sciences

Subject

Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Link

http://www.epjap.org/10.1051/epjap:2005034/pdf

Reference23 articles.

1. International Technology Roadmap for Semiconductors: 2003 Edition, Semiconductor Industry Association, http://public.itrs.net/

2. Ultrafast wafer alignment simulation based on thin film theory

3. Subwavelength alignment mark signal analysis of advanced memory products

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1. Detection of structural asymmetries in Forksheet FET arrays using Mueller matrix ellipsometry: a theoretical study;Journal of Micro/Nanopatterning, Materials, and Metrology;2024-02-09

2. Multi-spectral snapshot diffraction-based overlay metrology;Optics Letters;2023-06-16

3. Monitoring sidewall tilting of pixelated nanogratings in 3D display;Optics Express;2023-01-20

4. Mueller Matrix Microscopy;Polarized Light in Biomedical Imaging and Sensing;2022-11-15

5. Advanced Mueller matrix ellipsometry: Instrumentation and emerging applications;Science China Technological Sciences;2022-08-15

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