Multi-spectral snapshot diffraction-based overlay metrology

Abstract

Diffraction-based overlay (DBO) metrology has been successfully introduced to deal with the tighter overlay control in modern semiconductor manufacturing. Moreover, DBO metrology typically needs to be performed at multiple wavelengths to achieve accurate and robust measurement in the presence of overlay target deformations. In this Letter, we outline a proposal for multi-spectral DBO metrology based on the linear relation between the overlay errors and the combinations of off-diagonal-block Mueller matrix elements ΔM = M ij  − ( − 1) j M ji (i = 1, 2; j = 3, 4) associated with the zeroth-order diffraction of overlay target gratings. We propose an approach that can realize snapshot and direct measurement of ΔM over a broad spectral range without any rotating or active polarization component. The simulation results demonstrate the capability of the proposed method for multi-spectral overlay metrology in a single shot.