Effect of NO Annealing on 6H- and 4H-SiC MOS Interface States

Author:

Basile Alberto F.1,Rozen John2,Chen X.D.1,Dhar Sarit3,Williams John R.4,Feldman Leonard C.5,Mooney Patricia M.1

Affiliation:

1. Simon Fraser University

2. Central Research Institute of Electric Power Industry (CRIEPI)

3. Cree, Incorporation

4. Auburn University

5. Vanderbilt University

Abstract

The electrical properties of the SiC/SiO2 interface resulting from oxidation of the n-type 6H-SiC polytype were studied by hi-lo CV, temperature dependent CV and constant capacitance deep level transient spectroscopy (CCDLTS) techniques. Several trap species differing in energy and capture cross section were identified. A trap distribution at 0.5 eV below the 6H-SiC conduction band energy and a shallower density of states in both the 6H and 4H polytyes are passivated by post-oxidation NO annealing. However, other ultra-shallow and deeper defect distributions remain after nitridation. The latter may originate from semiconductor traps.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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