Affiliation:
1. Universiti Malaysia Perlis (UniMAP)
Abstract
The effect of Si3N4particulate addition on the commercial SN100C solder alloy has been investigated. The SN100C/Si3N4composite solder was fabricated via powder metallurgy (PM) technique. In this study five different Si3N4composition which have been chosen were (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %).The results showed that Si3N4particulate has remain as foreign particles and precipitate at the grain boundaries thus improved the physical properties of the composite solder compared to monolithic solder alloy. The addition of 1.0 wt. % Si3N4give highest hardness value to the composite solder.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference12 articles.
1. Y. Tang , G.Y.L., Y.C. Pan Journal of Alloys and Compounds. 554: pp.195-203. (2013).
2. Ping Liu, P.Y., and Jim Liu, Journal of Electronic Materials. 37(6). (2006).
3. Y. Tang, G.Y.L., Y.C. Pan Materials and Design. 55: p.574–582. (2014).
4. S.Y. Chang , C.C.J., T.H. Chuang , L.P. Feng , L.C. Tsao, Materials and Design. 32: pp.4720-4727. (2011).
5. Tsao, L.C., Journal of Alloys and Compounds. 509: pp.8441-8448. (2011).
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