Nickel (Ni) Microalloying Additions in Sn-Cu Lead-free Solder. Short Review
Author:
Publisher
IOP Publishing
Subject
General Medicine
Link
http://stacks.iop.org/1757-899X/209/i=1/a=012084/pdf
Reference22 articles.
1. Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints
2. A review of mechanical properties of lead-free solders for electronic packaging
3. Intermetallic Compound Formation on Solder Alloy/Cu-Substrate Interface Using Lead-Free Sn-0.7Cu/Recycled-Aluminum Composite Solder
4. Zn-Sn Based High Temperature Solder - A Short Review
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Improvement of PbSn Solder Reliability with Ge Microalloying-Induced Optimization of Intermetallic Compounds Growth;Materials;2024-02-02
2. The Effect of Nickel Addition on Lead-Free Solder for High Power Module Devices—Short Review;Springer Proceedings in Physics;2023
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