Effect of Additional Silane on In Situ H2 Etching prior to 4H-SiC Homoepitaxial Growth

Author:

Kojima Kazutoshi1,Kuroda Satoshi2,Okumura Hajime1,Arai Kazuo1

Affiliation:

1. National Institute of Advanced Industrial Science and Technology (AIST)

2. National Institute of Advanced Science and Technology (AIST)

Abstract

We have investigated the influence of in-situ H2 etching on the surface morphology of the 4H-SiC substrate prior to homoepitaxial growth. In this study, we varied the types of gas atmosphere during in-situ H2 etching; namely, hydrogen (H2) alone, hydrogen-propane (H2+C3H8), and hydrogen-silane (H2+SiH4). We found that in-situ H2 etching using H2 + SiH4 significantly improved the surface morphology of 4H-SiC substrate just after in-situ H2 etching. By adding SiH4, formation of bunched step structure during in-situ H2 etching could be significantly suppressed. In addition, H2 etching using H2 + SiH4 was able to remove scratches by etching a thinner layer than that using H2 alone. We also discussed the in-situ H2 etching mechanism under the additional SiH4 condition.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference6 articles.

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4. K. Kojima, T. Kato, S. Kuroda, H. Okumura, K. Arai: Mater. Sci. Forum in press.

5. R.N. Ghoshtagore, Sol. Stat. Elect. 9 (1966) 178.

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