Mechanical Characteristics of Electronic Printed Circuit Obtained by the Vapour Phase Soldering Process-Reference-Cited by-同舟云学术

Mechanical Characteristics of Electronic Printed Circuit Obtained by the Vapour Phase Soldering Process

Published:2014-10 Issue: Volume:658 Page:71-76
ISSN:1662-7482
Container-title:Applied Mechanics and Materials
language:
Short-container-title:AMM

Author:

Dumitru Georgiana Ionela¹,Tudor Andrei¹,Chisiu Georgiana¹,Plotog Ioan²

Affiliation:

1. Politehnica" University of Bucharest

2. "Politehnica" University of Bucharest

Abstract

The goal of the present paper is to describe some mechanical aspects regarding the adhesion of the copper layer deposit on the rigid support of printed circuit boards (PCB) used in electronic technology. In order to highlight the adhesion of the copper layer in correlation with different rigid support, there were performed some micro-scratch tests using a dedicated system. The mechanical strength is obtained by shear test. The paper novelty presents a mechanical experiment which will describe the tribological properties with influence on the reliability of electronic assemblies

Publisher

Trans Tech Publications, Ltd.

Link

https://www.scientific.net/AMM.658.71.pdf

Reference9 articles.

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2. I. Plotog, T. Cucu, et. al., Vapour Phase Soldering Technology Applications for PCB with different final finishes, International Symposium on Electronics and Telecommunications - ISETC 2010, 9th Edition, Timisoara, 11 – 12 November, pp.425-428, ISBN 978-1-4244-8458-4. (2010).

3. I. Plotog, M. Branzei, et. al, Solder Joints Quality Assessment as Function of Vapour Phase Soldering Process Parameters in the terms of 4P Soldering Model, European Microelectronics Packaging Conference – EMPC 2011, Brighton, (2011).

4. N. Gitis, J. Xiao, M. Vinogradov Multi-Sensor Testing of Thin and Thick Coatings, Proceedings of 26th Annual Meeting of The Adhesion Society, Myrtle Beach, pp.133-135, (2003).

5. UMT Multi-Specimen Test System Hardware Installation & Applications Manual.

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