Micro-scratching tests of a lead-free solder alloy SAC 305 used in electronic industry

Abstract

Abstract The electronic connections need to satisfy three functionalities and those are the electrical, thermal and mechanical functionalities. The PCB (Printed Circuit Board) has the role of providing a mechanical support for an assembly of various electrical and electronical components and to connect them to obtain a functional end-product. The goal of the present paper was to identify the mechanical and tribological properties of the lead-free soldering alloy SAC 305 deposit on the copper-PCB assembly used in electronic technology. The variation of the friction coefficient for all the normal forces applied on the test samples was analyzed. The understanding of the behavior of the lead-free soldering alloy for the micro scratch test is essential for the improvement of the hole electronic system integrity.