Influence of Non-Metallic Particles Addition on Wettability, Intermetallic Compound Formation and Microhardness of Sn-0.7Cu Lead Free Solder Paste

Abstract

A non metallic reinforcement has attracted most of the worldwide researchers to enhance solder performance. Silicon carbide (SiC) particle is a semiconductor which had been used as a non metallic reinforcement in this research study.The fabrication of Sn-0.7Cu lead free solder paste was done by mixing the solder powder with flux. Then, Sn-0.7Cu/SiC composite solder paste was prepared by mixing solder powder, flux and various weight percentage (wt%) of SiC. The amount of SiC particles added was 0, 0.25, 0.50, 0.75 and 1.0 wt%. The influence of SiC addition was analyzed based on its wettability, IMC layer formation and microhardness properties. The addition of SiC particles had decreased the contact angle as well as thinner the IMC layer. The morphology of IMC layer changed from scallop like shape to combination of scallop and planar like shape with the addition of SiC particle. Apart from that, the microhardness was enhanced with addition of SiC particle into Sn-0.7Cu lead free solder paste.