Development of a microwave sintered TiO2 reinforced Sn–0.7wt%Cu–0.05wt%Ni alloy

Author:

Mohd Salleh M.A.A.,McDonald S.D.,Terada Y.,Yasuda H.,Nogita K.

Funder

University of Queensland (UQ)-Nihon Superior (NS)

Australian National Fabrication Facility (ANNF) at the University of Queensland

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference52 articles.

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3. Diffusion of lead-free soldering in electronics industry in China;Xin;China Population, Resour. Environ.,2007

4. M. Yarime, Eco-innovation through university-industry collaboration network: co-evolution of technology and institution for the development of lead-free solders. DRUID Summer Conference 2009. Denmark, Copenhagen Business School, 2009.

5. Surface tension and load-carrying capacities of solder;Bell,2013

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