Development of lead-free Sn–0.7Cu/Al2O3nanocomposite solders with superior strength
Author:
Publisher
IOP Publishing
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0022-3727/41/i=9/a=095403/pdf
Reference38 articles.
1. Lead-free Solders in Microelectronics
2. Physics and materials challenges for lead-free solders
3. Advances in lead-free electronics soldering
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