Synthesis and characterization of Sn–Cu/SiO2(np) lead-free nanocomposite solder through angular accumulative extrusion
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s10854-023-10783-2.pdf
Reference29 articles.
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3. M. Abtew, G. Selvaduray, Lead-free solders in microelectronics. Mater. Sci. Engineering: R: Rep. 27(5–6), 95–141 (2000)
4. H.R. Kotadia, P.D. Howes, S.H. Mannan, A review: on the development of low melting temperature Pb-free solders. Microelectron. Reliab. 54(6–7), 1253–1273 (2014)
5. J.S. Hwang, Implementing lead-free Electronics (McGraw-Hill Professional Engin, 2005)
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