The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints-Reference-Cited by-同舟云学术

The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints

Published:2016-11 Issue: Volume:685 Page:471-482
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Zeng Guang,McDonald Stuart D.,Mu Dekui,Terada Yasuko,Yasuda Hideyuki,Gu Qinfen,Salleh M.A.A. Mohd,Nogita Kazuhiro

Funder

University of Queensland

Australian Synchrotron

, Japan

University of Queensland International

Graduate School International Travel Award (GSITA) of UQ

China Scholarship Council

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference63 articles.

1. The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7 Cu/Cu solder joints;Zeng;Acta Mater.,2015

2. Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying;El-Daly;J. Alloys Compd.,2015

3. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design;Koo;J. Alloys Compd.,2015

4. Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders;Ma;J. Alloys Compd.,2016

5. Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering;Yang;J. Alloys Compd.,2016

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