Affiliation:
1. University Politehnica Bucharest
2. National Institute for Research and Development in Microtechnologies -IMT Bucharest
3. Carpatcement Holding
Abstract
A partially electrically isolated package with a gold wire and fully isolated solution with a metallic piston, respectively, are designed and tested for high temperature sensors (400°C) based on SiC Schottky barrier diodes (SBD). Electrical behavior and sensor performance are very close for both packaging solutions. The stress due to contact pressure and higher cost are some disadvantages for pressure contact technology.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference4 articles.
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