High Temperature SiC Sensor with an Isolated Package

Author:

Draghici Florin1,Brezeanu Gheorghe2,Rusu Ion3,Bernea Florin4,Godignon Phillippe5

Affiliation:

1. University

2. University Politehnica Bucharest

3. University “Politehnica” Bucharest

4. Carpatcement Holding

5. IMB-CNM, CSIC

Abstract

This paper presents an improved version and new results on a temperature sensor based on SiC Schottky Barrier Diode (SBD). SiC SBD structures of different areas were packaged in a metallic-glass case. The encapsulated sensor was electrically measured at several temperatures. A good linearity of the forward voltage measured at a constant current versus temperature dependence was obtained in the temperature range of 150-400°C where the sensor is meant to operate. Optical investigation, correlated with electrical measurements, prove the reliability of the sensor structure and of the package solutions at temperatures up to 400°C.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference5 articles.

1. G. Brezeanu, F. Draghici, M. Badila, I. Rusu, F. Bernea, P. Godignon, A Fully Electrically Isolated Package for High Temperature SiC Sensors, Materials Science Forum Vols. 717-720, (2012), pp.925-928.

2. R. Pascu, F. Draghici, M. Badila, F. Craciunoiu, G. Brezeanu, A. Dinescu, I. Rusu, High Temperature Sensor Based on SiC Schottky Diodes with Undoped Oxide Ramp Termination, in Proc. of the 34th International Semiconductor Conference, Vol. 2, Sinaia, Romania, Oct. 2011, pp.379-382.

3. G. Bai, Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection, Dissertation Thesis of the Virginia Polytechnic Institute and State University, Oct. (2005).

4. F. Draghici, B. Ofrim, G. Brezeanu, F. Mitu, F. Bernea, High Temperature Automatic Characterization System For Semiconductor Devices, Annals of the Academy of Romanian Scientist – Series on Science and Technology of Information, Vol. 4, No. 2 (2011).

5. M. Knoerr, A. Schletz, Power Semiconductor Joining through Sintering of Silver Nanoparticles: Evaluation of Influence of Parameters Time, Temperature and Pressure on Density, Strength and Reliability, 6th CIPS, Nuremberg, Germany, (2010).

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