Affiliation:
1. The University of Tokyo
2. Kyushu University
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. [1] E. Higurashi, “Low-temperature bonding technologies for photonics applications”, ECS Transactions, vol.50, no.7, Semiconductor Wafer Bonding 12: Science, Technology, and Applications, pp.351-362, 2012.
2. [2] M.M.V. Taklo, P. Storås, K. Schjølberg-Henriksen, H.K. Hasting, and H. Jakobsen, “Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold,” J. Micromech. Microeng., vol.14, no.7, pp.884-890, 2004.
3. [3] Q.-Y. Tong, “Room temperature metal direct bonding,” Appl. Phys. Lett., vol.89, 182101, 2006.
4. [4] E. Higurashi, T. Imamura, T. Suga, and R. Sawada, “Low-temperature bonding of laser diode chips on Silicon substrates using plasma activation of Au films,” IEEE Photon. Tech. Lett., vol.19, no.24, pp.1994-1996, 2007.
5. [5] X.F. Ang, Z. Chen, C.C. Wong, and J. Wei, “Effect of chain length on low temperature gold-gold bonding by self-assembled monolayers,” Appl. Phys. Lett., vol.92, 131913, 2008.
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献