Author:
Elsotohy M.,Froehlich J.,Dietrich L.,Oppermann H.,Schneider-Ramelow M.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Atmospheric pressure plasma cleaning of gold Flip Chip bump for ultrasonic Flip Chip bonding;Koo;J. Phys.,2008
2. Characterization of low temperature, wafer-level gold-gold thermocompression bonds;Tsau;MRS Proc.,1999
3. Room-temperature gold-gold bonding method based on argon and hydrogen gas mixture atmospheric pressure plasma treatment for optoelectronic device integration;Higurashi;IEICE Trans.,2016
4. Flip-Chip-mounted pin-photodiode Array for 2.5 Gbit/s-per-channel parallel optical interconnections;Spalthoff,1996
5. Description of the Modelling of the Thermo- compression Bonding Process of Electroplated Structures;Klein,2013
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献