Low-temperature Cu/SiO2 hybrid bonding based on Ar/H2 plasma and citric acid cooperative activation for multi-functional chip integration
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference56 articles.
1. Three-dimensional integration of plasmonics and nanoelectronics;Liu;Nat. Electron.,2018
2. Carbon nanotube-based three-dimensional monolithic optoelectronic integrated system;Liu;Nat. Commun.,2017
3. N. Sillon, A. Astier, H. Boutry, L.D. Cioccio, D. Henry, P. Leduc, Enabling technologies for 3D integration: from packaging miniaturization to advanced stacked ICs, in: IEEE International Electron Devices Meeting, San Francisco, CA, USA, 2008, pp.1-4. https://doi.org/10.1109/IEDM.2008.4796761.
4. Wafer-level bonding/stacking technology for 3D integration;Ko;Microelectron. Reliab.,2010
5. Cu/SiO2 hybrid bonding obtained by surface-activated bonding method at room temperature using Si ultrathin films;Utsumi;Micro Nano Eng.,2019
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