Heterogeneous Integration Technology Using Low-Temperature Bonding and Its Application to Electronic Devices-Reference-Cited by-同舟云学术

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Heterogeneous Integration Technology Using Low-Temperature Bonding and Its Application to Electronic Devices

Published:2023-08-01 Issue:5 Volume:26 Page:427-433
ISSN:1343-9677
Container-title:Journal of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Higurashi Eiji¹

Affiliation:

1. Department of Electronic Engineering, Graduate School of Engineering, Tohoku University

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/jiep/26/5/26_427/_pdf

Reference45 articles.

1. 1) 特集／Heterogeneous Integration, エレクトロニクス実装学会誌，Vol. 20, No. 6, 2017

2. 2) https://eps.ieee.org/technology/heterogeneous-integration-roadmap.html

3. 3) 日暮栄治，須賀唯知：電気学会論文誌E (センサ・マイクロマシン部門誌)，Vol. 134, No. 6, pp. 159–165, 2014

4. 4) J. A. Dziuban: Bonding in Microsystem Technology (Springer Series in Advanced Microelectronics), 2006

5. 5) J. B. Lasky: Appl. Phys. Lett., Vol. 48, pp. 78–80, 1986

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