Electrical analysis of TSV step change in radius with compensation structure-Reference-Cited by-同舟云学术

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Electrical analysis of TSV step change in radius with compensation structure

Published:2015 Issue:12 Volume:12 Page:20150400-20150400
ISSN:1349-2543
Container-title:IEICE Electronics Express
language:en
Short-container-title:IEICE Electron. Express

Author:

Zheng Junping¹,Dong Gang¹,Yang Yintang¹,Zhao Yingbo¹,Fan Qingyang¹

Affiliation:

1. School of Microelectronics, Xidian University

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://www.jstage.jst.go.jp/article/elex/12/12/12_12.20150400/_pdf

Reference15 articles.

1. [1] J. Rosenfeld and E. G. Friedman: IEEE Trans. Very Large Scale Integr. (VLSI) Syst. 19 (2011) 1075. DOI:10.1109/TVLSI.2010.2045601

2. [2] Y. Peng, T. Song, D. Petranovic and S. K. Lim: IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 33 (2014) 1900. DOI:10.1109/TCAD.2014.2359578

3. [3] Y. B. Chen, E. Kursun, D. Motschman, C. Johnson and Y. Xie: IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 32 (2013) 1335. DOI:10.1109/TCAD.2013.2261120

4. [4] C. Xu, H. Li, R. Suaya and K. Banerjee: IEEE Trans. Electron Dev. 57 (2010) 3405. DOI:10.1109/TED.2010.2076382

5. [5] G. Katti, M. Stucchi, K. D. Meyer and W. Dehaene: IEEE Trans. Electron Dev. 57 (2010) 256. DOI:10.1109/TED.2009.2034508

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