Analysis of Neural Spike Signal Transmission Characteristics in 3-D Heterogeneous Integration-Reference-Cited by-同舟云学术

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Analysis of Neural Spike Signal Transmission Characteristics in 3-D Heterogeneous Integration

Published:2022-09-01 Issue: Volume: Page:
ISSN:
Container-title:2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
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Author:

Yu Heyuan¹,Sun Zhe¹,Lei Xiaoyong¹,Huo Shuyun¹,Li Yan²,Fang Lidan²,Xu Shaojie²,Li Erping³,Li Bingheng³

Affiliation:

1. Hebei University of Technology,College of Electronics & Information Engineering,Tianjin,China

2. China Ji-Liang University,Key Laboratory of Electromagnetic Wave Information Technology and Metrology of Zhejiang Province,Zhejiang,China

3. Zhejiang University,Key Laboratory of Advanced Micro-Nano Electronic Devices & Smart Systems and Applications,Zhejiang,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9888259/9888262/09888648.pdf?arnumber=9888648

Reference5 articles.

1. Hybrid spiking models

2. High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

3. Electrical analysis of TSV step change in radius with compensation structure

4. Recent advances in TSV inductors for 3DIC technology;kim;Proc Int SoC Design Conf (ISOCC),2016

5. Towards spike-based machine intelligence with neuromorphic computing;roy;Nature,2019

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Electromagnetic Perspective of Artificial Intelligence Neuromorphic Chips;Electromagnetic Science;2023-09

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