Author:
Katti Guruprasad,Stucchi Michele,De Meyer Kristin,Dehaene Wim
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
329 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs;IEEE Transactions on Circuits and Systems II: Express Briefs;2024-08
2. IR Drop Analysis for Power Integrity in 3D ICs;2024 International Conference on Integrated Circuits, Communication, and Computing Systems (ICIC3S);2024-06-08
3. An Equivalent Circuit Model for Elliptic Cylindrical TSV Considering the Temperature Influence;2024 2nd International Symposium of Electronics Design Automation (ISEDA);2024-05-10
4. An Efficient Statistical Clock Skew Analysis Method for Clock Trees;2024 2nd International Symposium of Electronics Design Automation (ISEDA);2024-05-10
5. H3D-Transformer: A Heterogeneous 3D (H3D) Computing Platform for Transformer Model Acceleration on Edge Devices;ACM Transactions on Design Automation of Electronic Systems;2024-04-22