Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits

Author:

Chen Yibo,Kursun Eren,Motschman Dave,Johnson Charles,Xie Yuan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. An Electrical–Thermal Co-Simulation Model of Chiplet Heterogeneous Integration Systems;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2024

2. Thermal-Aware Fixed-Outline 3-D IC Floorplanning: An End-to-End Learning-Based Approach;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-12

3. ATT-TA: A Cooperative Multiagent Deep Reinforcement Learning Approach for TSV Assignment in 3-D ICs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-12

4. A Novel Thermal-Aware Floorplanning and TSV Assignment With Game Theory for Fixed-Outline 3-D ICs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-11

5. Thermal modeling and analysis of 3-D integrated circuits with irregular structure;Thermal Science;2023

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