Influence of Near-Surface Defects in Si Induced by Reactive Ion Etching on the Electrical Properties of the Pt/n-Si Interface
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Predicting the effects of plasma-induced damage on p–n junction leakage and its application in the characterization of defect distribution;Journal of Vacuum Science & Technology B;2022-12
2. Characterization of Plasma Process-Induced Low-Density Defect Creation by Lateral Junction Leakage;IEEE Journal of the Electron Devices Society;2022
3. Characterization techniques of ion bombardment damage on electronic devices during plasma processing—plasma process-induced damage;Japanese Journal of Applied Physics;2021-03-23
4. Evaluation of residual defects created by plasma exposure of Si substrates using vertical and lateral pn junctions;Journal of Vacuum Science & Technology B;2020-01
5. Modeling of defect generation during plasma etching and its impact on electronic device performance—plasma-induced damage;Journal of Physics D: Applied Physics;2017-07-20
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